Lead Free No Clean Solder Paste [LFM-48]

Description:

Lead Free No Clean Solder Paste

Almit LFM-48 Alloy composition: Sn-3.0Ag-0.5Cu Lead Free No Clean Solder Paste withstands high-temperature pre-heats.

Flux Name	Flux content	Melting Point	Particle Size	Features
TM-HP	12%	217ºC ~ 218ºC	X W U	Good continuous printability Withstands high temperature pre-heating Improves BGA wettability.
TM-TS	11.5%	217ºC ~ 218ºC	X W	Good wettability and ball performance with high temperature pre-heating. Reduces voids and has Good ICT testability.
TM	11.5%	217ºC ~ 218ºC	X W	High reliable flux with excellent spreading performance and longer stability.

Storage: Please keep unopened jars refridgerated

Almit LFM-48 is available in 500g and 1000g Carts and 500g Jars.

LFM48 W TM-HP S (20/38) L1 Cart 500g
Model: [LFM-48]
Price: £70.00

Quantity :

LFM48 W TM-HP S (20/38) L1, Jar 500g
Model: [LFM-48]
Price: £70.00

Quantity :

LFM48 W TM-HP S (20/38) L1, Cart 1000g
Model: [LFM-48]
Price: £135.94

Quantity :